AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Glass Core PKG Teamin Leoben, Austria, we are looking for a passionate

Senior Engineer R&D - Patterning Process

In your role, you will play a key role in developing advanced circuit formation technologies for next-generation Glass Core Substrates. Working closely with material, equipment, and process suppliers, you will drive the development and optimization of patterning processes that enable high-density interconnect solutions. You will contribute to innovative packaging technologies by ensuring high process performance, manufacturability, and reliability, while collaborating with multidisciplinary teams across R&D and engineering.

• Develop circuit formation technologies for Glass Core Substrate by working closely with material, equipment, and process suppliers
• Lead process development and optimization of lithography, etching, plating, and related technologies for high-density circuit patterning
• Establish process windows to achieve target pattern quality, yield, and manufacturability while considering electrical and mechanical reliability requirements
• Conduct process evaluations covering pattern quality, defect reduction, adhesion performance, dimensional stability, and electrical characteristics
• Analyze failure mechanisms such as pattern defects, delamination, cracking, over/under etching, and process-induced reliability issues
• Work closely with cross-functional teams including process, material and reliability engineering to drive technology development and project execution

• Bachelor's/Master's degree in Materials Science, Chemical Engineering, Electronics Engineering, Mechanical Engineering, or related fields
• 7+ years of experience in microelectronic packaging, substrate, PCB, or process technology development
• Expertise in lithography, etching, plating, and circuit formation processes
• Understanding of process integration, defect analysis, yield improvement, and reliability considerations
• Familiarity with electrical and thermo-mechanical reliability requirements for substrate or packaging applications
• Strong responsibility-driven mindset for achieving development goals reliably and efficiently
• Fluency in English

• A meaningful role with opportunities for long-term growth in an international environment
• Chance to actively contribute to AT&S´ success and to create value
• A structured and tailor-made onboarding program along with continual training opportunities
• Modern company canteen with freshly prepared meals every day
• Free parking spaces and e-charging stations
• Diverse health measures and a wide range of employee benefits

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry (https://www.feei.at/wp-content/uploads/2024/04/angestellte-2025-05-01.pdf), employment group F-G, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.